Madhuparna Roy email & phone information | Packaging R And D Engineer, Engineering in Intel Corporation (2020-06 - Now)
Madhuparna Roy
Packaging R And D Engineer, Engineering in Intel Corporation (2020-06 - Now)
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Madhuparna Roy jobs:
Packaging R And D Engineer, Engineering in Intel Corporation (2020-06 - Now)
Graduate Research Assistant, Education, Researcher in High-Performance Materials Institute (2013-05 - Now)
Graduate Teaching Assistant in Florida State University (2015-08 - Now)
High-Performance Materials Institute
Program Coordinator, Operations in Nsf Rise Reu And Ret (2018-01 - 2019-05)
Madhuparna Roy contact information:
Phones
1+16*******40
Socials
5linkedin + 4 more
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