Ryan Keech email & phone information | Module Integration And Device Yield Engineer, Engineering in Intel Corporation (2017-02 - Now)

Ryan Keech

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Module Integration And Device Yield Engineer, Engineering in Intel Corporation (2017-02 - Now)

Ph.D Research Assistant, Education, Researcher in Penn State University (2011-08 - 2016-12)

Undergraduate Research Assistant, Education, Researcher in University Of Connecticut (2009-09 - 2011-05)

Summer Engineering Intern, Engineering in Eigenlight Corporation (2008-05 - 2010-08)

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Portland, Oregon, United States

United States, Pennsylvania, University Park

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r***.*****@g****.com

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