Taekkeun Lee email & phone information | Principal Packaing Engineer, Engineering in Fairchild Semiconductor (2010-02 - Now)
Taekkeun Lee
Principal Packaing Engineer, Engineering in Fairchild Semiconductor (2010-02 - Now)
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Taekkeun Lee jobs:
Principal Packaing Engineer, Engineering in Fairchild Semiconductor (2010-02 - Now)
Principal Packaing Engineer, Engineering in On Semiconductor (2016-09 - Now)
Senior Packaging Engineer, Engineering in Samsung (2009-09 - 2010-02)
Packaging Engineer, Engineering in Fairchild Semiconductor (2000-01 - 2009-08)
Taekkeun Lee contact information:
Emails
1t*******.***@f************.com
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3facebook + 2 more
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