Vladmir Perelman email & phone information | Senior Vice President Flip Chip, Bump And Wlcsp, Product Business Unit, Operations, Product in Amkor Technology (1999 - 2014-04)

Vladmir Perelman

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Senior Vice President Flip Chip, Bump And Wlcsp, Product Business Unit, Operations, Product in Amkor Technology (1999 - 2014-04)

Director Of Engineering, Engineering in Acqutek (1995 - 1999)

Director Of Engineering, Engineering in Dyna-Craft (1989 - 1995)

Plant Manager in Stamping Technology (1980 - 1989)

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San Francisco, California, United States

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v****@a****.com

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