Wolfgang Ecker email & phone information | Principal Package Concept Engineering, Engineering in Infineon Technologies (2016-01 - Now)

Wolfgang Ecker

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Principal Package Concept Engineering, Engineering in Infineon Technologies (2016-01 - Now)

Lead Principal Package Concept Engineering, Engineering

Senior Manager Packaging Concepts in Infineon Technologies (2015-03 - 2015-12)

Imc Principal And Senior Manager Package Technology Innovation in Intel Corporation (2014-06 - 2015-02)

Principal Wafer Level in Intel Corporation (2011-02 - 2014-05)

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Milpitas, California, United States

Detroit, Michigan, United States

San Diego, California, United States

Raleigh, North Carolina, United States

Hampstead, North Carolina, United States

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+17*******91 + 18 more

d****.******@i*******.com + 78 more

linkedin + 50 more

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