Wolfgang Ecker email & phone information | Lead Principal Package Concept Engineering, Engineering
Wolfgang Ecker
Lead Principal Package Concept Engineering, Engineering
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Wolfgang Ecker jobs:
Lead Principal Package Concept Engineering, Engineering
Principal Package Concept Engineering, Engineering in Infineon Technologies (2016-01 - Now)
Senior Manager Packaging Concepts in Infineon Technologies (2015-03 - 2015-12)
Imc Principal And Senior Manager Package Technology Innovation in Intel Corporation (2014-06 - 2015-02)
Principal Wafer Level in Intel Corporation (2011-02 - 2014-05)
+ 2 more
Wolfgang Ecker locations:
Gilroy, California, United States
Brookline, New Hampshire, United States
San Jose, California, United States
Hampstead, North Carolina, United States
Matthews, North Carolina, United States
+ 14 more
Wolfgang Ecker contact information:
Phones
19+17*******00 + 18 more
Emails
79s*******.********@i*******.com + 78 more
Socials
51linkedin + 50 more
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