Xiaofeng Sun email & phone information | Packaging R And D Engineer, Engineering in Intel Corporation (2017-04 - Now)

Xiaofeng Sun

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Packaging R And D Engineer, Engineering in Intel Corporation (2017-04 - Now)

Research Staff Member T J Watson Research Center, Education, Researcher in Ibm (2015-08 - Now)

Regional Sales Manager, Sales, Accounts in Spectralab Scientific

Advisory Test Specialist in Ibm (2011-01 - Now)

Support Engineer, Customer_Service, Support in Sap (2016-11 - Now)

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New York, New York, United States

Ireland

Phoenix, Arizona, United States

China

Hong Kong

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d**********@h******.com + 7 more

linkedin + 17 more

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