Yan Mu email & phone information | Packaging R And D Engineer, Engineering in Intel Corporation (2017-08 - Now)
Yan Mu
Packaging R And D Engineer, Engineering in Intel Corporation (2017-08 - Now)
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Yan Mu jobs:
Packaging R And D Engineer, Engineering in Intel Corporation (2017-08 - Now)
R And D Intern in Basf (2016-10 - 2017-08)
Research Assistant, Education, Researcher in The University Of Arizona (2013-08 - 2016-08)
R And D Intern in Cabot Microelectronics (2015-05 - 2015-08)
Research Assistant, Education, Researcher in Clarkson University (2010-08 - 2013-07)
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