Yeong Lee email & phone information | Assembly And Packaging in Nvidia (2012-03 - Now)
Yeong Lee
Assembly And Packaging in Nvidia (2012-03 - Now)
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Yeong Lee jobs:
Assembly And Packaging in Nvidia (2012-03 - Now)
Director, Wafer Scale Product And Technology Marketing, Operations, Product in Stats Chippac (2010-06 - 2012-03)
Ic Packaging Integration Team Lead in Motorola (2004 - 2010)
Technology Platform Leader in Dow Corning (1995 - 2004)
Senior Research Engineer, Education, Researcher in The Dow Chemical Company (1992 - 1995)
+ 1 more
Yeong Lee contact information:
Emails
1y****.***@a*****.brown.edu
Socials
2linkedin + 1 more
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